NXP恩智浦半導體應用手冊

AN10439 晶圓級芯片封裝

keywords 關鍵字

wafer,level,chip-scale,chip-size,package,WLCSP

摘要

This application note provides guidelines for the use of Wafer Level Chip Size Packages (WLCSP). For information on printed circuit board (PCB),footprint design and reflow soldering see application note AN10365 (Surface mount reflow soldering description).

該應用手冊可作為晶圓級芯片大小封裝（Wafer Level Chip Size Packages (WLCSP)）的使用指導。關于PCB印刷電路板引腳以及焊接的相關內容，請參考應用手冊AN10365。

AN10439 晶圓級芯片封裝.PDF

AN10897 ESD和EMC設計指導

keywords 關鍵字

ESD,EMC,PCB design

摘要

An introductory approach to designing for ESD. Understanding the ESD pulse, how passive components react over frequency, and PCB layout techniques are exposed.

本文檔介紹了ESD的設計。詳細介紹了ESD脈沖、被動器件對頻率的反應、PCB布局等。

AN10897 ESD和EMC設計指導.PDF

AN10436 TDA8932B/33(B) Class-D 音頻放大器

keywords 關鍵字

Class-D amplifier,High efficiency,Switch mode amplifier,Flat TV,平板電視

摘要

This application note describes a stereo Switched Mode Amplifier (SMA) for audio, based on either the TDA8932B or TDA8933(B) Class-D audio amplifier device of NXP Semiconductors, which has been designed for Flat TV applications.

該應用手冊詳細描述了基于NXP TDA8932B 或者 TDA8933(B) Class-D 器件的立體聲音頻放大器。NXP恩智浦半導體該產品已經設計應用于平板電視。

AN10436 TDA8932B/33(B) Class-D 音頻放大器.PDF